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Core I3-4000M Pintel Computer Processors , Intel Laptop CPU Mobile 3M Cache 2.40

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Core I3-4000M Pintel Computer Processors , Intel Laptop CPU Mobile 3M Cache 2.40

Brand Name : INTEL
Model Number : I3-4000M
Certification : ORIGINAL PARTS
Place of Origin : ORIGINAL
MOQ : 1 pieces
Price : Negotiation
Payment Terms : T/T, PayPal, Western Union, Escrow and others
Supply Ability : 2000pcs
Packaging Details : tray, 10cmX10cmX5cm
Product Collection : 4th i3 Processors
Code Name : Haswell
Vertical Segment : Mobile
Status : Launched
Launched Date : Q4'13
Lithography : 22nm
Package : FCPGA946
Use Conditon : PC notebook/tablet/
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Core I3-4000M Processer-Notebook CPU (mobile , 3M Cache, 2.40 GHz)-laptop processer


Core i3-4000M is a middle-class dual-core processor for laptops launched in Q2 2013. It is based on the Haswell architecture and is manufactured in 22nm. Due to Hyper-Threading, the two cores can handle up to four threads in parallel leading to better utilization of the CPU. Each core offers a base speed of 2.4 GHz and includes no Turbo Boost support.


Processor number i3-4000M:

Processor numberi3-4000M
FamilyCore i3 Mobile
Technology (micron)0.022
Processor speed (GHz)2.4
L2 cache size (KB)512
L3 cache size (MB)3
The number of cores2
EM64TSupported
HyperThreading technologySupported
Virtualization technologySupported
Enhanced SpeedStep technologySupported
Execute-Disable bit featureSupported

General information:

TypeCPU / Microprocessor
Market segmentMobile
FamilyIntel Core i3 Mobile
Model numberi3-4000M
CPU part number
  • CW8064701486802 is an OEM/tray microprocessor
Frequency2400 MHz
Bus speed5 GT/s DMI
Clock multiplier24
Package946-pin micro-PGA (rPGA946B)
SocketSocket G3 / rPGA946B
Size1.48" x 1.48" / 3.75cm x 3.75cm
Introduction dateSeptember 1, 2013 (launch)
June 4, 2013 (announcement)
End-of-Life dateLast order date for tray processors is July 1, 2016
Last shipment date for tray processors is January 6, 2017

Architecture / Microarchitecture:


MicroarchitectureHaswell
PlatformShark Bay
Processor coreHaswell
Core steppingC0 (SR1HC)
Manufacturing process0.022 micron
Data width64 bit
The number of CPU cores2
The number of threads4
Floating Point UnitIntegrated
Level 1 cache size2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size2 x 256 KB 8-way set associative caches
Level 3 cache size3 MB 12-way set associative shared cache
Physical memory32 GB
MultiprocessingUniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
Low power featuresEnhanced SpeedStep technology
Integrated peripherals / components
Integrated graphicsGPU Type: HD 4600
Graphics tier: GT2
Microarchitecture: Gen 7.5
Execution units: 20
Base frequency (MHz): 400
Maximum frequency (MHz): 1100
The number of supported displays: 3
Memory controllerThe number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1600, DDR3L-1600
Maximum memory bandwidth (GB/s): 25.6
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 2.0 interface

Integrated peripherals / components:


ntegrated graphicsGPU Type: HD 4600
Graphics tier: GT2
Microarchitecture: Gen 7.5
Execution units: 20
Base frequency (MHz): 400
Maximum frequency (MHz): 1100
The number of supported displays: 3
Memory controllerThe number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1600, DDR3L-1600
Maximum memory bandwidth (GB/s): 25.6
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 2.0 interface

Electrical / Thermal parameters:


Maximum operating temperature100°C
Thermal Design Power37 Watt


Product Tags:

laptop chips

      

mobile processor laptop

      
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